- Concentrated developer
- 32% Potassium Carbonate

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- Concentrated developer solution
- 45% Potassium Carbonate

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- Concentrated replenisher

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- Formulated to remove fully aqueous dry films and liquid resists in soak or spray applications.

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- Additional anti-tarnish protection while removing fully aqueous liquid photoresists in spray or soak applications.

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- Removes water hardness, photoresist and soldermask scum and metal salt deposits.

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- Citric based cleaner

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- A concentrated alkaline equipment cleaner designed to clean conveyorized processing equipment.

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- De-foamer FETM is a fully organic non-silicone water-soluble de-foamer that rinses readily and leaves no residue.

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- A highly effective foam suppressant for aqueous developing and stripping of photopolymer films.

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- A liquid persulfate-based copper micro-etch that is pre-mixed with sulfuric acid. ME 515L removes copper.

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- An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating.

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- Formulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching.

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- A nitric acid based solution for stripping tin or tin/lead from printed circuit boards.

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Thickness: 15 to 30um
- Excellent acid and alkaline etch resistance.
- Excellent conformation
- Excellent feature adhesion
- Multi wavelength exposure compatibility

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Thickness: 30 to 75um
- Excellent acid etch resistance
- Excellent gold plating
- Excellent feature adhesion
- Multi wavelength exposure compatibility

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Thickness: 1.3 to 4.0mils
- Excellent acid and alkaline etch resistance
- Excellent feature adhesion
- Excellent tenting
- Excellent Au Plating

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Thickness: 40 to 50um
- Excellent Resolution
- Excellent feature adhesion
- Excellent acid etch resistance

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Thickness 15um.
- High resolution imaging capability
- Multi-wavelength DI compatibility
- Excellent etching and plating latitude for M-SAP and HDI applications.

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Thickness: 30 to 75um
- Excellent Acid etch resistance
- Excellent tenting
- Excellent feature adhesion

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- Excellent tent protection
- Planar surface

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- Excellent topological conformation
- Excellent tent protection
- Planar Surface

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- Concentrated developer
- 32% Potassium Carbonate

- Concentrated developer solution
- 45% Potassium Carbonate

- Concentrated replenisher

- Formulated to remove fully aqueous dry films and liquid resists in soak or spray applications

- Additional anti-tarnish protection while removing fully aqueous liquid photoresists in spray or soak applications.

- Removes water hardness, photoresist and soldermask scum and metal salt deposits.

- Citric based cleaner

- A concentrated alkaline equipment cleaner designed to clean conveyorized processing equipment.

- De-foamer FETM is a fully organic non-Silicone water-soluble de-foamer that rinses readily and leaves no residue.

- A highly effective foam suppressant for aqueous developing and stripping of photopolymer films.

- A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper.

- An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating.

- Formulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching.

- A nitric acid based solution for stripping tin or tin/lead from printed circuit boards.

Thickness: 15 to 40um
- Excellent acid and alkaline etch resistance.
- Excellent conformation
- Excellent feature adhesion
- Multi wavelength exposure compatibility

Thickness: 30 to 70um
- Excellent acid etch resistance
- Excellent gold plating
- Excellent feature adhesion
- Multi wavelength exposure compatibility

Thickness: 1.3 to 4.0mils
- Excellent acid and alkaline etch resistance
- Excellent feature adhesion
- Excellent tenting
- Excellent Au Plating

Flexible PWB, Multilayer PWB, General Purpose Imaging

Thickness: 15 to 50um
- Excellent Resolution
- Excellent feature adhesion
- Excellent acid etch resistance

Thickness: 30 to 38um
- Excellent Acid etch resistance
- Excellent conformation and feature adhesion
- Multi wavelength DI exposure compatibility as well as conventional imaging.

Thickness 15um.
- High resolution imaging capability
- Multi-wavelength DI compatibility
- Excellent etching and plating latitude for M-SAP and HDI applications.

Thickness: 30 to 75um
- Excellent Acid etch resistance
- Excellent tenting
- Excellent feature adhesion

- Excellent tent protection
- Planar surface

- Excellent topological conformation
- Excellent tent protection
- Planar Surface